The chiplet interconnects have a bandwidth of 5.3 TB/s. The Radeon RX 7900 XTX has a 384-bit memory bus through the use of six MCDs while the RX 7900 XT has a 320-bit bus due to its five MCDs. With a respective 2.05 billion transistors, each Memory Cache Die (MCD) contains large blocks of 元 cache and two physical 32-bit GDDR6 memory interfaces for a combined 64-bit interface per MCD. The development of RDNA 3's chiplet architecture began towards the end of 2017 with Naffziger leading the AMD graphics team in the effort. The decision to move to a chiplet-based GPU microarchitecture was led by AMD Senior Vice President Sam Naffziger who had also lead the chiplet initiative with Ryzen and Epyc. AMD previously had great success with its use of chiplets in its Ryzen desktop and Epyc server processors. Architectural details Chiplet packaging įor the first time ever in a consumer GPU, RDNA 3 utilizes modular chiplets. įull details for the RDNA 3 architecture were unveiled on Novemat an event in Las Vegas. The preview included RDNA 3 running gameplay of Lies of P, AMD CEO Lisa Su confirming that a chiplet design would be used, and a partial look at AMD's reference design for an RDNA 3 GPU. Ī sneak preview for RDNA 3 was included towards the end of AMD's Ryzen 7000 unveiling event on August 29, 2022. AMD announced to investors their intention to achieve a performance-per-watt uplift of over 50% with RDNA 3 and that the upcoming architecture would be built using chiplet packaging on a 5 nm process. On June 9, 2022, AMD held their Financial Analyst Day where they presented a client GPU roadmap which contained mention of RDNA 3 coming in 2022 and RDNA 4 coming in 2024. RDNA 3 is a GPU microarchitecture designed by AMD, released with the Radeon RX 7000 series on December 13, 2022.
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